PCB Assembly
With state of the art assembly facility located at Nelamangala, We offer PCB assembly, functional testing and can cater to prototyping and mass volume manufacturing requirements of Customers. Our current manufacturing line with ASM machines from Siemens bring high precision capabilities and is configured to handle the entire spectrum of volume and complexities. With SAP Hana B1 used for planning and with support of Hicotronics for sourcing, we offer E2E Turnkey solutions to Customers.







- Fine Pitch SMT, Through-Hole & POP Assemblies, Backplane Assemblies
- PCB Assemblies Of Rigid, Flexi Rigid & Flexi Type
- Fine Pitch placements starting 01005 to a larger component of 45mm X 87.5mm
- Fine Pitch/Micro BGA's As Minimum Of 0.25mm
- Build To Spec (Concept, Design, Proto, Pilot, Mid & Low Volumes & Life Cycle Support)
- Build To Print (As Per Customer AVL & BOM)
- BGA Re-Ball And BGA Rework
- X-Ray Inspections For All Types Of BTC & PTH Components
- Special Processes Like Conformal Coating, Potting As Per Customer Requirements
- End to End Manufacturing traceability
Capabilities are as listed below
With AS9100D, IATF and ISO certification, Quality is at the core of all processes and work done at Himil. As part of future roadmap, we intend to expand our manufacturing capacity by mid of CY’24 and also adopt some of the industry proven automation to drive better quality, reliability and efficiency.

